英伟达最新AI平台Vera Rubin进入量产阶段，SK海力士、三星和美光之间的竞争正从层数比拼转向技术攻坚，芯片内部热管理已成为HBM5时代的关键突破口。AI硬件加速迭代，英伟达、AMD新一代AI服务器GPU单芯片功耗逼近1000W。HBM4已堆叠12至16层，HBM5将迈向20层堆叠。 阅读全文
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